Power heat sink |
Material: AlN/BeO |
Accuracy: line width/line spacing accuracy ±5um |
Metalization: Ti, Cu, Ni, Pt, Au, prefabricated AuSn film, etc |
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Chip components |
Precision : ±0.1% -- ±0.02% |
Passivation layer structure : SiO2+Si3N4、SiO2 |
Resistance range : 10Ω—1MΩ |
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Highly reliable subs |
Material: Al2O3/AlN. |
Accuracy: line width/line spacing accuracy ±5um |
Metalization: Ti, Ni, Pt, Au, thin film resistors, prefabricated AuSn films, etc |
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Coaxial attenuator |
Frequency :DC -18000 |
Attenuation: 0.7-1.3 |
Max standing wave ratio :1.3 |
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Thin film attenuator |
Applicable frequency : DC~ 18GHz |
Power : 1W |
Standing wave : ≤ 1.2 |
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Microwave substrate |
Material: Al2O3. |
Accuracy: line width/line spacing accuracy ±2.5um. |
Metalization: Ti, Ni, Pt, Au, TaN resistors, prefabricated AuSn films, etc. |
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Thin film Substrate |
Metalization: Ti, Ni, Pt, Au, TaN resistance, prefabricated AuSn film, etc |
Accuracy: line width/line spacing accuracy ±2.5um. |
Material: AlN/Al2O3/multilayer AlN-HTCC/quartz |
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